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 1.5V Drive Pch MOSFET
RW1A013ZP
Structure Silicon P-channel MOSFET Dimensions (Unit : mm)
WEMT6
(6)
(5)
(4)
Features 1) Low on-resistance. 2) High power package. 3) Low voltage drive. (1.5V)
(1)
(2)
(3)
Abbreviated symbol : XC
Application Switching
Inner circuit
(6) (5) (4)
2
Packaging specifications
Package Type Code Basic ordering unit (pieces) RW1A013ZP Taping T2R 8000
(1) (2) (3) 1 ESD PROTECTION DIODE 2 BODY DIODE
(1) Drain (2) Drain (3) Gate (4) Source (5) Drain (6) Drain
1
Absolute maximum ratings (Ta=25C)
Parameter Drain-source voltage Gate-source voltage Drain current Source current (Body diode) Total power dissipation Channel temperature Range of Storage temperature
1 Pw10s, Duty cycle1% 2 When mounted on a ceramic board
Continuous Pulsed Continuous Pulsed
Symbol VDSS VGSS ID IDP IS ISP PD Tch Tstg
1 1 2
Limits -12 10 1.3 2.6 -0.5 -2.6 0.7 150 -55 to +150
Unit V V A A A A W C C
Thermal resistance
Parameter Channel to ambient
When mounted on a ceramic board
Symbol Rth(ch-a)
Limits 179
Unit C / W
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c 2009 ROHM Co., Ltd. All rights reserved.
1/4
2009.06 - Rev.A
RW1A013ZP
Electrical characteristics (Ta=25C)
Parameter Symbol Min. IGSS - Gate-source leakage Drain-source breakdown voltage V(BR) DSS -12 Zero gate voltage drain current - IDSS Gate threshold voltage VGS (th) -0.3 - - Static drain-source on-state RDS (on) resistance - - Forward transfer admittance Yfs 1.4 Input capacitance Ciss - Output capacitance - Coss Reverse transfer capacitance - Crss Turn-on delay time td (on) - Rise time - tr Turn-off delay time - td (off) Fall time tf - Total gate charge - Qg Gate-source charge - Qgs Gate-drain charge Qgd -
Pulsed
Data Sheet
Typ. - - - - 190 280 400 530 - 290 28 21 8 10 30 9 2.4 0.6 0.4
Max. 10 - -1 -1.0 260 390 600 1060 - - - - - - - - - - -
Unit A V A V m m m m S pF pF pF ns ns ns ns nC nC nC
Conditions VGS=10V, VDS=0V ID= -1mA, VGS=0V VDS= -12V, VGS=0V VDS= -6V, ID= -1mA ID= -1.3A, VGS= -4.5V ID= -0.6A, VGS= -2.5V ID= -0.6A, VGS= -1.8V ID= -0.2A, VGS= -1.5V VDS= -6V, ID= -1.3A VDS= -6V VGS=0V f=1MHz VDD -6V ID= -0.6A VGS= -4.5V RL 10 RG=10 RL 4.6 VDD -6V ID= -1.3A RG=10 VGS= -4.5V
Body diode characteristics (Source-drain) (Ta=25C)
Parameter Forward voltage
Pulsed
Symbol VSD
Min. -
Typ. -
Max. -1.2
Unit V
Conditions IS= -1.3A, VGS=0V
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c 2009 ROHM Co., Ltd. All rights reserved.
2/4
2009.06 - Rev.A
RW1A013ZP
Electrical characteristics
2 DRAIN CURRENT : -ID [A] Ta=25C Pulsed 2 VGS= -10V VGS= -4.5V VGS= -2.5V VGS= -1.8V 1 VGS= -1.5V 0.5 VGS= -1.2V VGS= -1.0V 0 0 0.2 0.4 0.6 0.8 1 0 0 2 4 6 8 10 0.001 0 0.5 1 1.5 2 VGS= -4.5V VGS= -2.5V VGS= -1.8V Ta=25C Pulsed DRAIN CURRENT : -ID [A] 10 VDS= -6V Pulsed
Data Sheet
DRAIN CURRENT : -ID [A]
1.5
1.5
1 Ta= 125C Ta= 75C Ta= 25C Ta= - 25C
1
VGS= -1.5V
0.1
0.5
VGS= -1.2V
0.01
DRAIN-SOURCE VOLTAGE : -VDS[V] Fig.1 Typical Output Characteristics()
DRAIN-SOURCE VOLTAGE : -VDS[V] Fig.2 Typical Output Characteristics()
GATE-SOURCE VOLTAGE : -VGS[V] Fig.3 Typical Transfer Characteristics
10000 STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(ON)[m]
STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(ON)[m]
1000
1000
STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(ON)[m]
Ta=25C Pulsed
10000
VGS= -4.5V Pulsed
10000
VGS= -2.5V Pulsed
1000
100
VGS= -1.5V VGS= -1.8V VGS= -2.5V VGS= -4.5V
100
Ta=125C Ta=75C Ta=25C Ta= -25C 0.1 1 10
100
Ta=125C Ta=75C Ta=25C Ta= -25C 0.1 1 10
10 0.01
0.1
1
10
10 0.01
10 0.01
DRAIN-CURRENT : -ID [A] Fig.4 Static Drain-Source On-State Resistance vs. Drain Current()
DRAIN-CURRENT : -ID [A] Fig.5 Static Drain-Source On-State Resistance vs. Drain Current()
DRAIN-CURRENT : -ID [A] Fig.6 Static Drain-Source On-State Resistance vs. Drain Current()
1000
1000
FORWARD TRANSFER ADMITTANCE : |Yfs| [S]
10000 STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(ON)[m]
STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(ON)[m]
VGS= -1.8V Pulsed
10000
VGS= -1.5V Pulsed
10
VDS= -6V Pulsed
1 Ta= -25C Ta=25C Ta=75C Ta=125C 0.1 0.01
100
Ta=125C Ta=75C Ta=25C Ta= -25C
100
Ta=125C Ta=75C Ta=25C Ta= -25C
10 0.01
0.1
1
10
10 0.01
0.1
1
10
0.1
1
10
DRAIN-CURRENT : -ID [A] Fig.7 Static Drain-Source On-State Resistance vs. Drain Current()
DRAIN-CURRENT : -ID [A] Fig.8 Static Drain-Source On-State Resistance vs. Drain Current()
DRAIN-CURRENT : -ID [A] Fig.9 Forward Transfer Admittance vs. Drain Current
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c 2009 ROHM Co., Ltd. All rights reserved.
3/4
2009.06 - Rev.A
RW1A013ZP
10 REVERSE DRAIN CURRENT : -Is [A] 600 STATIC DRAIN-SOURCE ON-STATE RESISTANCE : R DS(ON)[m] VGS=0V Pulsed 500 400 300 200 100 0 0 0.5 1 1.5 0 2 4 6 8 10 ID = -0.6A ID = -1.3A Ta=25C Pulsed SWITCHING TIME : t [ns] 1000 tf 100 td (off)
Data Sheet
1
Ta=25C VDD = -6V VGS= -4.5V R G=10 Pulsed
0.1
Ta=125C Ta=75C Ta=25C Ta=-25C
10
tr 1 0.01 0.1
td (on)
0.01
1
10
SOURCE-DRAIN VOLTAGE : -VSD [V] Fig.10 Reverse Drain Current vs. Sourse-Drain Voltage
GATE-SOURCE VOLTAGE : -VGS[V] Fig.11 Static Drain-Source On-State Resistance vs. Gate Source Voltage
DRAIN-CURRENT : -ID [A] Fig.12 Switching Characteristics
5 GATE-SOURCE VOLTAGE : -VGS [V]
1000
CAPACITANCE : C [pF]
4
100
Ciss
3
2
1
Ta=25C VDD = -6V ID = -1.3A R G=10 Pulsed
10
Coss Crss Ta=25C f=1MHz VGS=0V
0 0 0.5 1 1.5 2 2.5 3
1 0.01 0.1 1 10 100 DRAIN-SOURCE VOLTAGE : -VDS[V] Fig.14 Typical Capacitance vs. Drain-Source Voltage
TOTAL GATE CHARGE : Qg [nC] Fig.13 Dynamic Input Characteristics
Measurement circuits
Pulse width
ID VGS RL D.U.T. RG VDD VDS
VGS
10% 50% 10%
90%
50% 10% 90%
VDS
90% td(on) ton tr td(off) toff
tf
Fig.1-1 Switching time measurement circuit
Fig.1-2 Switching waveforms
VG
ID VGS RL IG(Const.) RG D.U.T. VDD VDS
Qg VGS Qgs Qgd
Charge
Fig.2-1 Gate charge measurement circuit
Fig.2-2 Gate charge waveform
Notice This product might cause chip aging and breakdown under the large electrified environment . Please consider to design ESD protection circuit.
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c 2009 ROHM Co., Ltd. All rights reserved.
4/4
2009.06 - Rev.A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.
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